Pin Configuration
Rerolling

Spindle Repair

Pin repair restores electronic components that have become deformed or misaligned. This meticulous process ensures that connectivity is restored and guarantees reliable component performance during assembly processes.

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Re-packaging of components

Reballing involves replacing the solder balls on components—particularly BGAs—to restore their original characteristics. When performed with precision, this process extends the lifespan of the components while ensuring their compatibility and performance in production.

FAQ

What types of components can you straighten?

We specialize in straightening pins for QFP and TQFP packages. Each repair is followed by 3-dimensional coplanarity tests to ensure optimal weldability.

How do you ensure the quality of a BGA reballing process?

The reballing of your BGA components always includes 3D coplanarity tests to verify that the balls are perfectly shaped before they are mounted on your circuit boards.

Is there a risk that these procedures could damage the chips?

No, the CS Electronics team has more than 30 years of experience in this field. Procedures are performed manually or by expert systems in strict compliance with thermal and ESD precautions.

Pin ConfigurationRerolling

Spindle Repair

Contact Us

Re-packaging of components

FAQ

Pin Configuration
Rerolling