Drying

Drying and Process Control

Components are dried with precision to ensure that moisture is removed and their integrity is preserved. This essential process helps prevent the risk of failure during assembly, while ensuring compliance with the requirements of even the most sensitive industrial environments.

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Qualified staff and compliance with standards

All operations are carried out by trained and meticulous staff, in strict accordance with your specifications. Each service is performed in compliance with current standards, ensuring a high level of quality, traceability, and reliability.

FAQ

What temperatures do you use for drying?

We adjust the temperature based on the material: from 40°C to 70°C (with ≤ 1% RH) for SMD components, and up to 125°C for curing PCBs (printed circuit boards). Our ovens can reach up to 600°C if necessary.

What standard governs your drying services?

Our aging cycles and moisture sensitivity level (MSL) management are conducted in accordance with the JEDEC 033D standard.

Are the components protected immediately after drying?

Absolutely. After drying, the components are packaged in Dry Packs (vacuum-sealed under nitrogen) with the addition of moisture indicators and desiccant to preserve their condition.